Precise rework of an assembly under the stereo microscope
A signature solution from Weber Electronic – part of the Bauer MSG Group

X-ray-qualified assembly rescue

Rework, X-ray analysis and precise reprocessing for electronic assemblies – developed to correct series defects, avoid failures and save valuable electronics from being scrapped.

02 Relevance
When errors become expensive, clarity and speed count.

A series defect rarely shows up immediately. It sits as a cold solder joint under the BGA, as an air pocket in the potting compound or as an oxidized contact that still passes the test and fails in the field. Until the cause is established, production lots stand still, delivery dates wobble – and in the worst case, a recall is already underway. Anyone who guesses in this situation loses twice: once the assemblies and once the time. That is why diagnosis comes before repair with us.

Hidden solder defects directly beneath the component – not optically testable
BGA / LGA Hidden solder defects directly beneath the component – not optically testable
Air pockets in solder joints and potting compound
QFN voids Air pockets in solder joints and potting compound
Aged, poorly solderable contacts and pads
Oxidation Aged, poorly solderable contacts and pads
Warranty, recall risk and reputational damage
Field failure Warranty, recall risk and reputational damage
03 Solution

From diagnosis to the tested assembly

Four steps that build on each other. Each step delivers a result you can keep using – as a finding, as a process or as a released assembly.

01

X-ray analysis

X-ray inspection makes visible what lies beneath the component: voids, solder bridges, missing balls, cracks and voids. Non-destructive, without opening or sacrificing the assembly. You receive a finding with imagery – the basis for deciding on rework or scrap instead of guessing.

  • Non-destructive – the assembly remains usable
  • BGA, LGA and QFN fully assessable
  • Voids, bridges and cavities documented
  • Finding including imagery
02

Microscopy & failure analysis

What the X-ray image shows is evaluated under the microscope: solder joint quality, wetting, surfaces and mechanical damage. Individual findings become a failure pattern – and from that, the answer to the real question: is this an isolated case or a series problem that is still in production?

  • Assessment of solder joints and wetting
  • Distinguishing isolated cases from series defects
  • Root cause instead of just the symptom
  • Clear recommendation for further action
03

Rework & selective soldering

For every assembly, we develop the appropriate rework process – from replacing individual BGAs to selective rework of entire assembly areas. Temperature profiles are matched to your material so that the repair does not become the next defect. Also for gold contacts and special materials, where standard processes reach their limits.

  • BGA, LGA and QFN replacement
  • Matched temperature profiles
  • Selective soldering instead of full-bath soldering
  • Gold contacts and special materials
04

Cleaning & qualification

After rework comes release. Controlled cleaning processes remove flux residues and contamination, then the result is tested and documented. You get the assembly back not only repaired, but with evidence that holds up in your quality file.

  • Controlled cleaning processes
  • Testing after rework
  • Documented release
  • Evidence for your quality file
04 Fields of application

Who is this solution for?

Wherever assemblies are too valuable to be written off in the event of a defect – from the production lot to the spare part that can no longer be bought.

05 Benefits

What you get out of it

Repair and component recovery are not a workshop service but an economic decision: the analysis costs a fraction of what rejects, new procurement and downtime cost together.

98 % Rescue rate

Repair instead of scrap

Assemblies that others have already given up on go back from us functional and tested – including component recovery where the component is worth more than the PCB.

48 h Typical turnaround time

Back to deliverable quickly

Analysis and rework mesh instead of waiting for each other. So that your production keeps running and delivery dates are met.

30+ Years of experience

Cases others decline

Gold contacts, special materials, highly complex BGA and SMD assemblies: where standard processes end, our work begins.

Clarity instead of speculation

An X-ray finding ends the discussion about what the cause is. You decide on the basis of imagery – not on the basis of assumptions.

Less scrap and hazardous waste

Every repaired assembly saves material, energy and disposal. Sustainability that shows up in the calculation and not only in the sustainability report.

Avoid recalls

Anyone who knows the cause early stops the defect in the lot instead of in the market. That is the difference between rework and reputational damage.

Increase product quality and reliability

Anyone who knows the cause of the defect corrects it not only on the individual assembly but in the process. What you deliver afterwards is demonstrably better than what would have gone through without analysis.

Ensure delivery capability

A blocked lot does not have to cost the delivery date. Repaired assemblies keep your shipments running – especially when components cannot be re-procured at short notice on the market.

X-ray inspection of an assembly for non-destructive failure analysis
06 Trust

Why Weber Electronic?

Weber Electronic has been working for over 30 years on assemblies that others have long written off. "There is no such thing as 'can't'" is not an advertising slogan for us but the basis of our work: we take on the cases where standard processes reach their limits – gold contacts, special materials, highly complex BGA and SMD assemblies.

Behind this is no improvised approach but analysis and inspection technology with which every step can be substantiated. X-ray, microscopy, matched rework and controlled cleaning work hand in hand. In the end, there is not only a working assembly but evidence that you can pass on.

That this also turns out well ecologically is a consequence, not marketing: in 2024, Ilona and Freddy Weber were awarded the first Sustainability Award of the Upper Palatinate. As part of the Bauer MSG Group – a competent, full-scope EMS and industrial electronics partner – we additionally draw on the group's development and manufacturing when an assembly needs more than rework.

  • ISO 9001:2015 certified
  • ISO 14001 certified
  • First Sustainability Award of the Upper Palatinate (2024)
  • Specialized in repair and component recovery
  • X-ray, microscopy and analysis technology in-house
  • Documented, audit-ready processes
  • Part of the Bauer MSG Group

Contact

We make the fastest progress when we can see the component. Briefly describe the failure pattern and the quantity – we will tell you whether an analysis is worthwhile and what it costs before you commission anything.

Weber Electronic

Weber Electronic GmbH

Nasting 9

93499 Zandt

+49 (0) 99 44 30 46 06